Nvidia has reportedly asked Taiwan Semiconductor Manufacturing Company (TSMC) to increase monthly production of 3-nanometer wafers for its Blackwell chips by roughly 50%, from about 100,000–110,000 units to nearly 160,000. The request aims to accelerate delivery of next-generation AI processors amid record demand from hyperscalers and enterprise clients.
The Blackwell architecture powers Nvidia’s newest AI data-center GPUs and has seen overwhelming orders from major cloud providers. Expanding wafer supply ensures Nvidia can meet production targets ahead of the rollout of its upcoming Rubin platform, expected to debut in 2026.
For TSMC, the ramp-up highlights the dominance of its advanced manufacturing processes and underscores Nvidia’s reliance on the Taiwanese chipmaker to sustain its leadership in the global AI hardware market.
